Engineering - Manufacturing

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Contract Manufacturing Engineering

http://www.dkengineering.com/index.asp

http://www.domailleengineering.com/

http://www.kalowtech.com/

http://appliedengineering.com/

http://www.steffes.com/contract-engineering/tool-and-die.html

http://www.cardinalpeak.com/contractengineering.php


Cardinal Peak Sales Pitch

GREATER FOCUS Engaging contract engineering services can foster greater discipline and focus around project requirements and deadlines.

Also, contract engineering services can deliver more concentrated focus on projects than in-house engineers who are pulled in different directions, from developing multiple projects to doing "maintenance" engineering.

SPEED OF DEPLOYMENT Contract engineering services can quickly bring expertise that is not required for a company's normal workflow to the table when needed. Outsourced engineering services afford a quicker time to market and lower overall costs.

As a contract engineering services provider, Cardinal Peak rapidly brings to bear engineering expertise that a client may not have in-house. We deliver senior talent very quickly, sparing our clients the headaches and costs of recruiting and hiring.

HIGH-QUALITY RESULTS Contract engineering services can offer more sustainable intellectual property and facilitate a greater transfer of core knowledge than hiring internal staff. While many internal members of a core project team are moved to other projects and/or leave the company once a project is complete, a contract engineering services provider can deliver well-documented code for internal use, and be available for re-engagement on a flexible basis.

In addition, Cardinal Peak's contract engineering services offer a higher likelihood of delivering a high-quality product on time than bringing on new staff.

COST EFFICIENCIES Contract engineering services allow you to add expert external resources to your project without adding ongoing operating costs, or worrying about keeping new hires busy after a major project is completed.

Contract engineering also enables you to control and verify costs more clearly than in-house engineering.

GREATER BREADTH OF EXPERIENCE One advantage that an outsourcing engineering team has over internal engineering resources is that the contract engineering team, by its nature, is exposed to a wide array of different projects and companies, and thus has a broader set of experiences from which to draw the optimal solution. Whether that has to do with finding a clever technical solution or implementing a process that works, the best contract engineering teams are adept at bringing the best practices in the industry to your company and your project.

KNOW WHAT TO LOOK FOR Here are a few key questions to consider in qualifying an outsourced engineering services provider:

  • How long has the firm been in business? How long will they be in business?
  • What tangible success stories do they have of products brought to market or other requirements fulfilled?
  • Can the firm deliver a continuum of services, from developing high-level requirements to working on subsystem components to augmenting the internal team with a qualified staffing solution?
  • Does the firm have a proven track record of delivering differentiated, feature-rich embedded devices?
  • Will senior staff be assigned to the project?
  • Which personnel at the firm will be responsible for the success of your project? Does the firm have a defined, proven process for project management and customer communication?

Apple 2011 OEM Suppliers List

The following is an alphabetical listing of Apple production suppliers. These suppliers represent 97 percent of Apple’s procurement expenditures for materials, manufacturing, and assembly of Apple’s products worldwide.

AAC Technologies Holdings Inc. Daishinku Corporation (KDS) Interflex Co., Ltd.

AcBel Polytech Inc. Darfon Electronics Corporation International Rectifier Corporation

Acument Global Technologies Delta Electronics Inc. Intersil Corporation

Advanced Micro Devices, Inc. Diodes Inc. Inventec Appliances Corporation

Amperex Technology Ltd. Dynapack International Technology Jabil Circuit, Inc.

Amphenol Corporation Elpida Memory, Inc. Japan Aviation Electronics Industry, Ltd.

Analog Devices, Inc. Emerson Electric Co. Jin Li Mould Manufacturing Pte Ltd.

Anjie Insulating Material Co., Ltd. ES Power Co., Ltd. Kaily Packaging Pte Ltd.

Asahi Kasei Corporation Fairchild Semiconductor International Kenseisha Sdn. Bhd.

AU Optronics Corporation Fastening Technology Pte Ltd. Knowles Electronics

Austria Technologie & Systemtechnik AG FLEXium Interconnect, Inc. Kunshan Changyun Electronic Industry

austriamicrosystems Flextronics International Ltd. Laird Technologies

Avago Technologies Ltd. Fortune Grand Enterprise Co., Ltd. Lateral Solutions Pte Ltd.

Brady Corporation Foster Electric Co., Ltd. Lens One Technology (Shenzhen) Co., Ltd.

Brilliant International Group Ltd. Fuji Crystal Manufactory Ltd. LG Chem, Ltd.

Broadcom Corporation Fujikura Ltd. LG Display Co., Ltd.

Broadway Industrial Group Ltd. Grand Upright Technology Ltd. LG Innotek Co., Ltd.

ByD Company Ltd. Gruppo Dani S.p.A. Linear Technology Corporation

Career Technology (MFG.) Co., Ltd. Gruppo Peretti Lite-On Technology Corporation

Catcher Technology Co., Ltd. Hama Naka Shoukin Industry Co., Ltd. Longwell Company

Cheng Loong Corporation Hanson Metal Factory Ltd. LSI Corporation

Cheng Uei Precision Industry Co., Ltd. (Foxlink) Heptagon Advanced Micro-Optics Pte Ltd. Luen Fung Commercial Holdings Ltd.

Chimei Innolux Corporation Hi-P International Ltd. Macronix International Co., Ltd.

Coilcraft, Inc. Hitachi-LG Data Storage Marian, Inc.

Compeq Manufacturing Co., Ltd. Hon Hai Precision Industry Co., Ltd. (Foxconn) Marvell Technology Group Ltd.

Cosmosupplylab Ltd. Hynix Semiconductor Inc. Maxim Integrated Products, Inc.

CymMetrik (Shenzhen) Printing Co. Ibiden Co., Ltd. Meiko Electronics Co., Ltd.

Cyntec Co., Ltd. Infineon Technologies AG Microchip Technology Inc.

Cypress Semiconductor Corporation Intel Corporation Micron Technology, Inc.

Mitsumi Electric Co., Ltd. Ri-Teng Computer Accessory Co., Ltd. Suzhou Panel Electronic Co., Ltd.

Molex Inc. ROHM Co., Ltd. Taiyi Precision Tech Corporation

Multek Corporation Rubycon Corporation Taiyo Yuden Co., Ltd.

Multi-Fineline Electronix, Inc. Samsung Electro-Mechanics Co., Ltd. TDK Corporation

Murata Manufacturing Co., Ltd. Samsung Electronics Co., Ltd. Texas Instruments Inc.

Nan ya Printed Circuit Board Corporation SanDisk Corporation Tianjin Lishen Battery Joint-Stock Co., Ltd.

NEC Corporation SANYO Electric Co., Ltd. Toshiba Corporation

Nippon Mektron, Ltd. SDI Corporation Toshiba Mobile Display Co., Ltd.

Nishoku Technology Inc. Seagate Technologies Toyo Rikagaku Kenkyusho Co., Ltd.

NVIDIA Corporation Seiko Epson Corporation TPK Holding Co., Ltd.

NXP Semiconductor N.V. Seiko Group Tripod Technology Corporation

ON Semiconductor Corporation Sharp Corporation TriQuint Semiconductor

Optrex Corporation Shimano Inc. Triumph Lead Electronic Tech Co.

Oriental Printed Circuits Ltd. Shin Zu Shing Co., Ltd. TXC Corporation

Panasonic Corporation Silego Technology Inc. Unimicron Corporation

PCH International Simplo Technology Co., Ltd. Unisteel Technology Ltd.

Pegatron Corporation Skyworks Solutions Inc. Universal Scientific Industrial Co., Ltd.

Pioneer Material Precision Tech Sony Corporation Vishay Intertechnology

Prent Corporation Standard Microsystems Corporation Volex plc

Primax Electronics Ltd. STMicroelectronics Western Digital Corporation

Qualcomm Incorporated Sumida Corporation Wintek Corporation

Quanta Computer Inc. Sumitomo Electric Industries, Ltd. yageo Corporation

Renesas Electronics Corporation Sunrex Technology Corporation Zeniya Aluminum Engineering, Ltd



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